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thermosensorik Thermal Stress Analysis (TSA) 紅外熱應(yīng)力分析儀

Under strain, components can develop material stresses. In almost all cases, designers now use numerical methods for the deployed material and the use case. Despite the great progress in modelling and practical experience with even complex components, faults cannot be entirely ruled out in the production and later operation of the assembly. This results in premature component failure.

A non-destructive test method is called for that detects non-conformant stress distribution in order to avoid such early failures, and also for process inspection and production monitoring.

Thermal stress analysis is a test method that works quickly and contact-free. It considerably accelerates the feedback loop of quality information from pre-series development and production to the design department.

Various types of referencing (automatically or via external reference signal) and evaluation (constant amplitude, correlation or random mode) can be chosen. In use at numerous Thermosensorik GmbH customers for more than six years.